Basic Elements
 
Diodes Incorporated’s Miniature High-Speed Switching Diodes Reduce PCB Size
19 Mar 2012

Diodes Incorporated has introduced a family of high-speed switching diodes in a choice of small footprint, low-profile packages, enabling significant reductions in component count and PCB area.  Featuring breakdown voltage ratings of 75V, 80V and 85V, the product line offers switching diode arrays in the miniature plastic SOT563, DFN1006-3 and DFN2020-6 packages.

 

Suitable for mobile handsets, tablets and notebooks, where light weight, slim product design is essential, these single, dual and dual-dual (both series and common cathode) diode configurations will handle a variety of functions including AC signal rectification, data line protection, reverse battery protection and DC/DC conversion.

 

The switching diodes’ total capacitance performance, ranging from just 2pF up to 4pF, ensures that distortion or degradation of high bandwidth input signals is minimized, while a breakdown voltage of up to 85V means that the diodes will handle the most severe switching circuit transient spikes.

 

Further information from http://www.diodes.com

 

About Diodes Incorporated

 

Diodes Incorporated (Nasdaq: DIOD), a Standard and Poor’s SmallCap 600 and Russell 3000 Index company, is a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic, and analog semiconductor markets.  Diodes serves the consumer electronics, computing, communications, industrial, and automotive markets.  Diodes' products include diodes, rectifiers, transistors, MOSFETs, protection devices, functional specific arrays, single gate logic, amplifiers and comparators, Hall-effect and temperature sensors; power management devices, including LED drivers, DC-DC switching and linear voltage regulators, and voltage references along with special function devices, such as USB power switches, load switches, voltage supervisors, and motor controllers.  The Company’s corporate headquarters, logistics center, and Americas’ sales office are located in Plano, Texas.  Design, marketing, and engineering centers are located in Plano; San Jose, California; Taipei, Taiwan; Manchester, England; and Neuhaus, Germany.  The Company’s wafer fabrication facilities are located in Kansas City, Missouri and Manchester, with two manufacturing facilities located in Shanghai, China, another in Neuhaus, and a joint venture facility located in Chengdu, China.  Additional engineering, sales, warehouse, and logistics offices are located in Taipei; Hong Kong; Manchester; and Munich, Germany; with support offices located throughout the world.  For further information, including SEC filings, visit the Company's website at http://www.diodes.com.

 

# # #

 

Issued on behalf of Diodes Incorporated

by EBA Communications

 

For further information please contact:

Gary Yu (Diodes): (886) 2-8914-6000

(email: gary_yu@tw.diodes.com)

 

Lucille Li/Andy Wong (EBA): (852) 2537 8022

(email: lucille.li@ebacomms.com or andy.wong@ebacomms.com)

 

Note to editors: this release can be found on the EBA website at www.ebacomms.com. It is also available by email. Call Ivy Chong at (852) 2537 8022 (email: ivy.chong@ebacomms.com) if you wish to make use of this service.

 

 

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