Diodes Inc. has expanded its range of DiodeStarÔ products with the introduction of two new 600V DiodeStar rectifiers targeted at Power Factor Correction (PFC) boost diode applications. The DSR6V600P5 and the DSR6U600P5 are housed in Diodes' proprietary powerDIâ5 package, a thermally efficient low-profile small-form-factor package, which enables the design of thinner and cooler products.
With an off-board profile of 1.1mm, the ultra small powerDI5 package is 52% thinner than the industry standard DPak and occupies just 43% of the board space. In addition, it offers significantly lower thermal resistance (Rthj-c), thus enabling higher density designs.
Optimized for use in PFC circuits that operate in Continuous Conduction Mode (CCM), the DSR6V600P5 features low reverse recovery time (Trr) and reverse recovery charge (Qrr) to ensure that boost diode reverse recovery losses are kept to a minimum. Similarly, the DSR6U600P5 has been tuned for both low forward voltage drop (VF) and low Trr in order to meet the compromise requirements of those PFC circuits operating under Boundary Conduction Mode (BCM).
Both the DSR6V600P5 and DSR6U600P5 feature a typical softness factor of 0.7, to ensure soft switching with decreased electrical noise that can lead to a reduction of EMI shielding and snubber circuits for simplified design and lower component count.
These new high voltage rectifiers are particularly suitable for use in high density Switched Mode Power Supplies (SMPS) for LED TVs and adaptors, and are also ideal as re-circulation diodes in High Intensity Discharge (HID) lighting applications.
About Diodes Incorporated
Diodes Incorporated (Nasdaq: DIOD), a Standard and Poor's SmallCap 600 and Russell 3000 Index company, is a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic, and analog semiconductor markets. Diodes serves the consumer electronics, computing, communications, industrial, and automotive markets. Diodes' products include diodes, rectifiers, transistors, MOSFETs, protection devices, functional specific arrays, single gate logic, amplifiers and comparators, Hall-effect and temperature sensors; power management devices, including LED drivers, DC-DC switching and linear voltage regulators, and voltage references along with special function devices, such as USB power switches, load switches, voltage supervisors, and motor controllers. The Company's corporate headquarters, logistics center, and Americas' sales office are located in Plano, Texas. Design, marketing, and engineering centers are located in Plano; San Jose, California; Taipei, Taiwan; Manchester, England; and Neuhaus, Germany. The Company’s wafer fabrication facilities are located in Kansas City, Missouri and Manchester, with two manufacturing facilities located in Shanghai, China, another in Neuhaus, and a joint venture facility located in Chengdu, China. Additional engineering, sales, warehouse, and logistics offices are located in Taipei; Hong Kong; Manchester; and Munich, Germany; with support offices located throughout the world. For further information, including SEC filings, visit the Company's website at http://www.diodes.com.
Issued on behalf of Diodes Incorporated
by EBA Communications
For further information please contact:
Gary Yu (Diodes): (886) 2-8914-6000
Lucille Li/Andy Wong (EBA): (852) 2537 8022
(email: email@example.com or firstname.lastname@example.org)